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ATWILC3000 датащи(PDF) 36 Page - ATMEL Corporation

номер детали ATWILC3000
подробное описание детали  Single Chip IEEE 802.11 b/g/n Link Controller withIntegrated Bluetooth 4.0
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производитель  ATMEL [ATMEL Corporation]
домашняя страница  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

ATWILC3000 датащи(HTML) 36 Page - ATMEL Corporation

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ATWILC3000 Single Chip IEEE 802.11 b/g/n Link Controller with
Integrated Bluetooth 4.0 [DATASHEET]
Atmel-42390D-ATWILC3000-MUT-SmartConnect-Datasheet_05/2016
3
6
36
13
Reflow Profile Information
This chapter provides guidelines for reflow processes in getting the Atmel module sold
ered to the customer’s
design.
13.1
Storage Condition
13.1.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed.
13.1.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
13.2
Stencil Design
The recommended stencil is laser-cut, stainless-steel type with thickness of 100µm to 130µm and
approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a positive taper with
bottom opening 25µm larger than the top can be utilized. Local manufacturing experience may find other
combinations of stencil thickness and aperture size to get good results.
13.3
Baking Conditions
This module is rated at MSL level 3. After sealed bag is opened, no baking is required within 168 hours so long
as the devices are held at
≤30°C/60% RH or stored at <10% RH.
The module will require baking before mounting if:
The sealed bag has been open for >168 hours
Humidity Indicator Card reads >10%
SIPs need to be baked for 8 hours at 125°C
13.4
Soldering and Reflow Condition
13.4.1 Reflow Oven
It is strongly recommended that a reflow oven equipped with more heating zones and Nitrogen atmosphere be
used for lead-free assembly. Nitrogen atmosphere has shown to improve the wet-ability and reduce
temperature gradient across the board. It can also enhance the appearance of the solder joints by reducing the
effects of oxidation.
The following bullet items should also be observed in the reflow process:
Some recommended pastes include NC-SMQ® 230 flux and Indalloy® 241 solder paste made up of 95.5
Sn/3.8 Ag/0.7 Cu or SENJU N705-GRN3360-K2-V Type 3, no clean paste
Allowable reflow soldering times: 3 times based on the following reflow soldering profile (see Figure 13-
1)
Temperature profile: Reflow soldering shall be done according to the following temperature profile (see
Figure 13-1)
Peak temp.: 250°C


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