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LTM8050 датащи(PDF) 18 Page - Linear Technology |
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LTM8050 датащи(HTML) 18 Page - Linear Technology |
18 / 24 page LTM8050 18 8050fc For more information www.linear.com/LTM8050 APPLICATIONS INFORMATION stillairalthoughnaturalconvectioncausestheairtomove. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom is the thermal resistance between the junction andbottomofthepackagewithallofthecomponentpower dissipation flowing through the bottom of the package. In the typical µModule converter, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJCtopisdeterminedwithnearlyallofthecomponentpower dissipation flowing through the top of the package. As the electricalconnectionsofthetypicalµModuleconverterare on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc- tion to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule converter and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. Giventhesedefinitions,itshouldnowbeapparentthatnone of these thermal coefficients reflects an actual physical operating condition of a µModule converter. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the product’s data sheet. The only appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. A graphical representation of these thermal resistances follows: The blue resistances are contained within the µModule converter, and the green are outside. The die temperature of the LTM8050 must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8050. The bulk of the heat flow out of the LTM8050 is through the bottom of the μModule converter and the LGA pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. 8050 F04 µMODULE DEVICE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION At CASE (BOTTOM)-TO-BOARD RESISTANCE |
Аналогичный номер детали - LTM8050 |
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Аналогичное описание - LTM8050 |
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