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LTM8050 датащи(PDF) 18 Page - Linear Technology

номер детали LTM8050
подробное описание детали  58V, 2A Step-Down 關Module Regulator
Download  24 Pages
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производитель  LINER [Linear Technology]
домашняя страница  http://www.linear.com
Logo LINER - Linear Technology

LTM8050 датащи(HTML) 18 Page - Linear Technology

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LTM8050
18
8050fc
For more information www.linear.com/LTM8050
APPLICATIONS INFORMATION
stillairalthoughnaturalconvectioncausestheairtomove.
This value is determined with the part mounted to a JESD
51-9 defined test board, which does not reflect an actual
application or viable operating condition.
θJCbottom is the thermal resistance between the junction
andbottomofthepackagewithallofthecomponentpower
dissipation flowing through the bottom of the package. In
the typical µModule converter, the bulk of the heat flows
out the bottom of the package, but there is always heat
flow out into the ambient environment. As a result, this
thermal resistance value may be useful for comparing
packages but the test conditions don’t generally match
the user’s application.
θJCtopisdeterminedwithnearlyallofthecomponentpower
dissipation flowing through the top of the package. As the
electricalconnectionsofthetypicalµModuleconverterare
on the bottom of the package, it is rare for an application
to operate such that most of the heat flows from the junc-
tion to the top of the part. As in the case of θJCbottom, this
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really the
sum of the θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two sided,
two layer board. This board is described in JESD 51-9.
Giventhesedefinitions,itshouldnowbeapparentthatnone
of these thermal coefficients reflects an actual physical
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
follows:
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8050 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8050. The bulk of the heat flow out of the LTM8050
is through the bottom of the μModule converter and the
LGA pads into the printed circuit board. Consequently a
poor printed circuit board design can cause excessive
heating, resulting in impaired performance or reliability.
Please refer to the PCB Layout section for printed circuit
board design suggestions.
8050 F04
µMODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
At
CASE (BOTTOM)-TO-BOARD
RESISTANCE


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