поискавой системы для электроныых деталей |
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74LVC3GU04 датащи(PDF) 2 Page - NXP Semiconductors |
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74LVC3GU04 датащи(HTML) 2 Page - NXP Semiconductors |
2 / 16 page 9397 750 14546 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 01 February 2005 2 of 16 Philips Semiconductors 74LVC3GU04 Triple inverter 3. Quick reference data [1] CPD is used to determine the dynamic power dissipation (PD in µW). PD =CPD × VCC2 × fi × N+ ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(C L × VCC 2 × f o) = sum of outputs. [2] The condition is VI = GND to VCC. 4. Ordering information 5. Marking Table 1: Quick reference data GND = 0 V; Tamb = 25 °C. Symbol Parameter Conditions Min Typ Max Unit tPHL, tPLH propagation delay inputs nA to outputs nY CL = 30 pF; RL =1kΩ; VCC = 1.8 V - 2.3 - ns CL = 30 pF; RL = 500 Ω; VCC = 2.5 V - 1.8 - ns CL = 50 pF; RL = 500 Ω; VCC = 2.7 V - 2.6 - ns CL = 50 pF; RL = 500 Ω; VCC = 3.3 V - 2.3 - ns CL = 50 pF; RL = 500 Ω; VCC = 5.0 V - 1.7 - ns CI input capacitance - 5 - pF CPD power dissipation capacitance per gate VCC = 3.3 V [1] [2] -7 - pF Table 2: Ordering information Type number Package Temperature range Name Description Version 74LVC3GU04DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC3GU04DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74LVC3GU04GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm SOT833-1 Table 3: Marking codes Type number Marking code 74LVC3GU04DP VU04 74LVC3GU04DC VU4 74LVC3GU04GT VU4 |
Аналогичный номер детали - 74LVC3GU04 |
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Аналогичное описание - 74LVC3GU04 |
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