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LM2781TPX датащи(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали LM2781TPX
подробное описание детали  Ultra-Low Ripple Switched Capacitor Voltage Inverter
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2781TPX датащи(HTML) 3 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Notes 1,
2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN pin: Voltage to GND
−0.3V to 5.8V
SD pin: Voltage to GND
-0.3V to
(V
IN + 0.3V), with
5.8V max
Output Short-to-GND Duration
(Note 3)
1 sec.
Maximum Junction Temperature
(T
J-MAX)
150˚C
Storage Temperature Range
-65˚C to +150˚C
Pad Temperature
(Soldering, 10 sec.)
265˚C
ESD Rating (Note 4)
Human-body model
Machine model
2kV
200V
Operating Ratings (Notes 1, 2)
Input Voltage Range
1.8V to 5.5V
Junction Temperature (T
J) Range
-40˚C to +90˚C
Ambient Temperature (T
A) Range
(Note 5)
-40˚C to +85˚C
Thermal Properties
Junction-to-Ambient Thermal
220˚C/W
Resistance (
θ
JA), TPA08 Package
(Note 6)
Electrical Characteristics
(Notes 2, 7)
Limits in standard typface are for T
J = 25˚C, and limits in boldface type apply over the full operating junction temperature
range (-40˚C
≤ T
J
≤ +90˚C). Unless otherwise noted: specifications apply to the LM2781 Typical Application Circuit (pg. 1) with
V
IN = 5.0V, V(SD) = 0V, and CIN =COUT = C1 = C2 = 1µF. (Note 8)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
R
OUT
Output Resistance
(Note 9)
I
OUT = 10mA, C2 = 1µF
8
30
I
OUT = 10mA, C2 removed
18
40
I
Q
Supply Current
No load
0.7
1.4
mA
I
SD
Shutdown Supply Current
V(SD) = 5.0V
0.1
0.5
µA
F
SW
Switching Frequency
100
210
400
kHz
V
SD
Shutdown Pin Logic Levels
Normal Operation
1.8V
≤ V
IN
≤ 5.5V
0
0.5
V
Shutdown Mode
1.8V
≤ V
IN
≤ 5.5V
0.5xV
IN
V
IN
V
OUTp-p
Output Voltage Ripple
V
IN = 5.0V, IOUT = 10mA
10
mV
P
EFF
Power Efficiency
V
IN = 5.0V, IOUT = 10mA
92
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics table.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: VOUT may be shorted to GND for one second without damage when the ambient temperature is at or below 85˚C. Prolonged or repeated shorts of VOUT
to GND may damage the device, and should be avoided.
Note 4: The human-body model is a 100pF capacitor discharged through a 1.5k
Ω resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin.
Note 5: Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 90˚C), the maximum power dissipation
of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part in the application (θJA), as given by the following equation: TA-MAX
=TJ-MAX-OP -(θJA xPD-MAX).
Note 6: Junction-to-ambient thermal resistance of the micro SMD package is highly application and board-layout dependent.
Note 7: Max and Min limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8: CIN,COUT, C1, and C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
Note 9: Output resistance is a model for the voltage drop at the output, resulting from internal switch resistance, capacitor ESR, and charge pump charge transfer
characteristics. Output voltage can be predicted with the following equation: VOUT = -[VIN -(IOUT xROUT)]
www.national.com
3


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