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LM2781TPX датащи(PDF) 3 Page - National Semiconductor (TI) |
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LM2781TPX датащи(HTML) 3 Page - National Semiconductor (TI) |
3 / 7 page Absolute Maximum Ratings (Notes 1, 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. V IN pin: Voltage to GND −0.3V to 5.8V SD pin: Voltage to GND -0.3V to (V IN + 0.3V), with 5.8V max Output Short-to-GND Duration (Note 3) 1 sec. Maximum Junction Temperature (T J-MAX) 150˚C Storage Temperature Range -65˚C to +150˚C Pad Temperature (Soldering, 10 sec.) 265˚C ESD Rating (Note 4) Human-body model Machine model 2kV 200V Operating Ratings (Notes 1, 2) Input Voltage Range 1.8V to 5.5V Junction Temperature (T J) Range -40˚C to +90˚C Ambient Temperature (T A) Range (Note 5) -40˚C to +85˚C Thermal Properties Junction-to-Ambient Thermal 220˚C/W Resistance ( θ JA), TPA08 Package (Note 6) Electrical Characteristics (Notes 2, 7) Limits in standard typface are for T J = 25˚C, and limits in boldface type apply over the full operating junction temperature range (-40˚C ≤ T J ≤ +90˚C). Unless otherwise noted: specifications apply to the LM2781 Typical Application Circuit (pg. 1) with V IN = 5.0V, V(SD) = 0V, and CIN =COUT = C1 = C2 = 1µF. (Note 8) Symbol Parameter Conditions Min Typ Max Units R OUT Output Resistance (Note 9) I OUT = 10mA, C2 = 1µF 8 30 Ω I OUT = 10mA, C2 removed 18 40 Ω I Q Supply Current No load 0.7 1.4 mA I SD Shutdown Supply Current V(SD) = 5.0V 0.1 0.5 µA F SW Switching Frequency 100 210 400 kHz V SD Shutdown Pin Logic Levels Normal Operation 1.8V ≤ V IN ≤ 5.5V 0 0.5 V Shutdown Mode 1.8V ≤ V IN ≤ 5.5V 0.5xV IN V IN V OUTp-p Output Voltage Ripple V IN = 5.0V, IOUT = 10mA 10 mV P EFF Power Efficiency V IN = 5.0V, IOUT = 10mA 92 % Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: VOUT may be shorted to GND for one second without damage when the ambient temperature is at or below 85˚C. Prolonged or repeated shorts of VOUT to GND may damage the device, and should be avoided. Note 4: The human-body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Note 5: Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 90˚C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP -(θJA xPD-MAX). Note 6: Junction-to-ambient thermal resistance of the micro SMD package is highly application and board-layout dependent. Note 7: Max and Min limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 8: CIN,COUT, C1, and C2: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Note 9: Output resistance is a model for the voltage drop at the output, resulting from internal switch resistance, capacitor ESR, and charge pump charge transfer characteristics. Output voltage can be predicted with the following equation: VOUT = -[VIN -(IOUT xROUT)] www.national.com 3 |
Аналогичный номер детали - LM2781TPX |
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Аналогичное описание - LM2781TPX |
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