поискавой системы для электроныых деталей
Selected language     Russian  ▼
название детали
         подробно


CD4046B датащит (Datasheet) 1 Page - Silicon Supplies

№ деталь CD4046B
подробность  CMOS High Voltage Logic
скачать  8 Pages
Scroll/Zoom Zoom In 100% Zoom Out
производитель  SS [Silicon Supplies]
домашняя страница  https://siliconsupplies.com/
Logo 

   
 1 page
background image
 
 
 CMOS High Voltage Logic – CD4046B
 
CMOS Micropower Phase Locked Loop (PLL) in bare die form
Rev 1.0
21/09/18
 
Description
Features:
 
Choice of two Phase Comparators:
 
 
 
 
 
The CD4046B phase locked loop consists of two
phase comparators, a voltage-controlled oscillator
(VCO), source follower and zener diode. The
comparators have a common signal input amplifier and
common comparator input. The zener diode is used
for power supply regulation if required.  Applications
include FM and FSK modulation / demodulation,
frequency synthesis and multiplication, frequency
discrimination, tone decoding, data synchronization
and conditioning, voltage-to-frequency conversion and
motor speed control.
-
Exclusive Or Gate, duty cycle limited
-
Rising edge switching, duty cycle unlimited
Buffered outputs compatible with MHTL and Low
power TTL
VCO inhibit control for ON-OFF keying and ultra-
low standby power consumption
Source-follower output of VCO control input
Integrated zener diode to assist supply regulation
Supply voltage range: 3V to 18V
Symmetrical output characteristics
 
 
 
 
The followi
 
ng part suffixes apply:
No suffix - MIL-STD-883 /2010B Visual Inspection
 
Ordering Information
Die Dimensions in µm (mils)
1930 (76)
 
 
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
 
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
 
LAT = Lot Acceptance Test.
 
 
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
 
 
Supply Formats:
1930 x 2210
 
 
 
 
Die Size (Unsawn)
76 x 87
µm
mils
106 x 106
Minimum Bond Pad Size
4.17 x 4.17
µm
mils
635 (±20)
Die Thickness
25 (±0.79)
µm
mils
Mechanical Specification
Default – Die in Waffle Pack (100 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 635µm(25 Mils) – On request
Top Metal Composition
Al 1%Si 1.1µm
Assembled into Ceramic Package – On request
Back Metal Composition
N/A – Bare Si
Page 1 of 8 
www.siliconsupplies.com




Html Pages

1  2  3  4  5  6  7  8 


датащит скачать




ссылки URL

Вашему бизинису помогли Аллдатащит?  [ DONATE ]  

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность    |   закладка   |   обмен ссыками   |   поиск по производителю
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl