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74LVC3GU04DCTRE4 датащи(PDF) 1 Page - Texas Instruments |
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74LVC3GU04DCTRE4 датащи(HTML) 1 Page - Texas Instruments |
1 / 11 page www.ti.com FEATURES DCT OR DCU PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 1A 3Y 2A GND VCC 1Y 3A 2Y 4 3 2 1 5 6 7 8 GND 2A 3Y 1A 2Y 3A 1Y VCC YEP OR YZP PACKAGE (BOTTOM VIEW) DESCRIPTION/ORDERING INFORMATION SN74LVC3GU04 TRIPLE INVERTER GATE SCES539A – JANUARY 2004 – REVISED APRIL 2005 • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Max tpd of 3.9 ns at 3.3 V • Low Power Consumption, 10- µA Max I CC • ±24-mA Output Drive at 3.3 V • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C • Unbuffered Outputs • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) This triple inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC3GU04 contains three inverters with unbuffered outputs and performs the Boolean function Y = A. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC3GU04YEPR 0.23-mm Large Bump – YEP Reel of 3000 _ _ _CD_ NanoFree™ – WCSP (DSBGA) SN74LVC3GU04YZPR 0.23-mm Large Bump – YZP (Pb-free) –40°C to 85°C SSOP – DCT Reel of 3000 SN74LVC3GU04DCTR CU4_ _ _ Reel of 3000 SN74LVC3GU04DCUR VSSOP – DCU CU4_ Reel of 250 SN74LVC3GU04DCUT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2004–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Аналогичный номер детали - 74LVC3GU04DCTRE4 |
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Аналогичное описание - 74LVC3GU04DCTRE4 |
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