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DLPC900_V01 датащит (Datasheet) 67 Page - Texas Instruments

№ деталь DLPC900_V01
подробность  DLPC900 Digital Controller for Advanced Light Control
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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67
DLPC900
www.ti.com
DLPS037D – OCTOBER 2014 – REVISED MARCH 2019
Product Folder Links: DLPC900
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Copyright © 2014–2019, Texas Instruments Incorporated
Layout Guidelines (continued)
10.1.4 Recommended MOSC Crystal Oscillator Configuration
A recommended crystal oscillator configuration is shown in Figure 40.
It is assumed that the external crystal oscillator will stabilize within 50 ms after stable power is applied.
Table 14. Crystal Port Characteristics
PARAMETER
NOMINAL
UNIT
MOSC-to-GND capacitance
1.5
pF
MOSCZ-to-GND capacitance
1.5
pF
(1)
Typical drive level with the XSA020000FK1H-OCX crystal (ESRmax = 40 Ω) = 50 µW
Table 15. Recommended Crystal Configuration (1)
PARAMETER
RECOMMENDED
UNIT
Crystal circuit configuration
Parallel resonant
Crystal type
Fundamental (first harmonic)
Crystal nominal frequency
20
MHz
Crystal temperature stability
± 30
PPM
Crystal frequency tolerance (including accuracy,
temperature, aging, and trim sensitivity)
± 100
PPM
Crystal equivalent series resistance (ESR)
50 max
Ω
Crystal load
20
pF
Crystal shunt load
7 max
pF
RS drive resistor (nominal)
100
Ω
RFB feedback resistor (nominal)
1
CL1 external crystal load capacitor (MOSC)
See Equation 1
pF
CL2 external crystal load capacitor (MOSCN)
See Equation 2
pF
PCB layout
A ground isolation ring around the crystal is recommended
CL1 = 2 × (CL – CStray-MOSC)
(1)
CL2 = 2 × (CL – CStray-MOSCN
(2)
where
CL = Crystal load capacitance (Farads)
CStray-MOSC = Sum of package and PCB capacitance at the crystal pin associated with controller signal MOSC.
CStray-MOSCN = Sum of package and PCB capacitance at the crystal pin associated with controller signal MOSCN. (3)




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