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GS8170LW36C-333I датащи(PDF) 1 Page - GSI Technology |
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GS8170LW36C-333I датащи(HTML) 1 Page - GSI Technology |
1 / 27 page GS8170LW36/72C-333/300/250/200 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM™ 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O 209-Bump BGA Commercial Temp Industrial Temp Rev: 2.03 1/2005 1/27 © 2002, GSI Technology, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM ™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices SigmaRAM Family Overview GS8170LW36/72 SigmaRAMs are built in compliance with the SigmaRAM pinout standard for synchronous SRAMs. They are 18,874,368-bit (18Mb) SRAMs. This family of wide, very low voltage CMOS I/O SRAMs is designed to operate at the speeds needed to implement economical high performance networking systems. ΣRAMs are offered in a number of configurations including Late Write, Double Late Write, and Double Data Rate (DDR). The logical differences between the protocols employed by these RAMs mainly involve various approaches to write cueing and data transfer rates. The ΣRAM™ family standard allows a user to implement the interface protocol best suited to the task at hand. Functional Description Because SigmaRAMs are synchronous devices, address data inputs and read/write control inputs are captured on the rising edge of the input clock. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing. ΣRAMs support pipelined reads utilizing a rising-edge- triggered output register. They also utilize a Dual Cycle Deselect (DCD) output deselect protocol. ΣRAMs are implemented with high performance CMOS technology and are packaged in a 209-bump BGA. 209-Bump, 14 mm x 22 mm BGA 1 mm Bump Pitch, 11 x 19 Bump Array Bottom View Parameter Synopsis Key Fast Bin Specs Symbol - 333 Cycle Time tKHKH 3.0 ns Access Time tKHQV 1.6 ns |
Аналогичный номер детали - GS8170LW36C-333I |
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Аналогичное описание - GS8170LW36C-333I |
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