TPPM0110

DUAL LOW-DROPOUT LINEAR REGULATOR

SLVS365 –MARCH 2001

11

POST OFFICE BOX 655303

APPLICATION INFORMATION

In a multilayer board application, the thermal vias are the primary method of heat transfer from the package

thermal pad to the internal ground plane. The efficiency of this method depends on several factors (die area,

number of thermal vias, thickness of copper, etc.). Consult the PowerPAD Thermally Enhanced Package

Technical Brief.

single layer PCB

Package Outline

Use as Much Copper Area

as Possible for Heat Spread

Package Thermal Pad

Figure 10. Land Configuration for Single-Layer PCB

Layout recommendation is to utilize as much copper area for the power management section of a single-layer

board as possible. In a single-layer board application, the thermal pad is attached to a heat spreader (copper

areas) by using a low thermal impedance attachment method (solder paste or thermal-conductive epoxy). In

both of these cases, it is advisable to use as much copper traces as possible to dissipate the heat.

IMPORTANT

If this attachment method is not implemented correctly, this

product will not operate efficiently. Power dissipation capability

will be adversely affected if the device is incorrectly mounted

onto the circuit board.

4

TPPM0110

20-Pin DWP

PowerPAD

Package

6

5VCC

3.3VOUT

0.1

µF

100

µF

0.1

µF

8

1.8VOUT

20

GND

100

µF

5VCC

3.3VOUT

100

µF

0.1

µF

1.8VOUT

† It is recommended that the capacitors on the outputs (100

µF) have a low ESR < 1 Ω.

These stabilizing capacitors must be placed in close proximity of their corresponding output terminals for optimal performance.

†

†

Figure 11. Application Schematic