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TPPM0110DWP датащи(PDF) 11 Page - Texas Instruments |
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TPPM0110DWP датащи(HTML) 11 Page - Texas Instruments |
11 / 14 page TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 11 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors (die area, number of thermal vias, thickness of copper, etc.). Consult the PowerPAD Thermally Enhanced Package Technical Brief. single layer PCB Package Outline Use as Much Copper Area as Possible for Heat Spread Package Thermal Pad Figure 10. Land Configuration for Single-Layer PCB Layout recommendation is to utilize as much copper area for the power management section of a single-layer board as possible. In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by using a low thermal impedance attachment method (solder paste or thermal-conductive epoxy). In both of these cases, it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT If this attachment method is not implemented correctly, this product will not operate efficiently. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. 4 TPPM0110 20-Pin DWP PowerPAD Package 6 5VCC 3.3VOUT 0.1 µF 100 µF 0.1 µF 8 1.8VOUT 20 GND 100 µF 5VCC 3.3VOUT 100 µF 0.1 µF 1.8VOUT † It is recommended that the capacitors on the outputs (100 µF) have a low ESR < 1 Ω. These stabilizing capacitors must be placed in close proximity of their corresponding output terminals for optimal performance. † † Figure 11. Application Schematic |
Аналогичный номер детали - TPPM0110DWP |
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Аналогичное описание - TPPM0110DWP |
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