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74ALVC16244DL датащи(PDF) 2 Page - NXP Semiconductors

номер детали 74ALVC16244DL
подробное описание детали  2.5V/3.3V 16-bit buffer/line driver 3-State
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74ALVC16244DL датащи(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
74ALVC16244/
74ALVCH16244
16-bit buffer/line driver (3-State)
2
1998 Jun 29
853-2082 19638
FEATURES
Wide supply voltage range of 1.2V to 3.6V
Complies with JEDEC standard no. 8-1A
CMOS low power consumption
MULTIBYTETM flow-through standard pin-out architecture
Low inductance multiple V
CC and GND pins for minimum noise
and ground bounce
Direct interface with TTL levels
Bus hold on data inputs (74ALVCH16244 only)
Output drive capability 50Ω transmission lines @ 85°C
Current drive ±24 mA at 3.0 V
DESCRIPTION
The 74ALVC16244(74ALVCH16244) is a 16-bit non-inverting
buffer/line driver with 3-State outputs. The device can be used as
four 4-bit buffers, two 8-bit buffers or one 16-bit buffer. The 3-State
outputs are controlled by the output enable inputs 1OE and 2OE. A
HIGH on nOE causes the outputs to assume a high impedance
OFF-state.
The 74ALVCH16244 has active bus hold circuitry which is provided
to hold unused or floating data inputs at a valid logic level. This
feature eliminates the need for external pull-up or pull-down
resistors.
The 74ALVC16244 has 5V tolerant inputs.
PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
1OE
1Y0
1Y1
GND
1Y2
1Y3
VCC
2Y1
GND
2Y2
2Y3
3Y0
3Y1
GND
2Y0
3Y2
3Y3
VCC
4Y0
4Y1
4A1
4A0
VCC
3A3
3A2
GND
3A1
3A0
2A3
2A2
GND
2A1
2A0
VCC
1A3
1A2
GND
1A1
1A0
2OE
21
22
23
24
25
26
27
28
GND
4Y2
4Y3
4OE
3OE
4A3
4A2
GND
SW00194
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25°C; tr = tf ≤ 2.5 ns
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
tPHL/tPLH
Propagation delay
An to Yn
VCC = 2.5V, CL = 30pF
VCC = 3.3V, CL = 50pF
1.9
1.9
ns
CI
Input capacitance
5.0
pF
C
Power dissipation capacitance per buffer
V = GND to VCC1
Outputs enabled
25
pF
CPD
Power dissipation capacitance per buffer
VI = GND to VCC1
Outputs disabled
4
pF
NOTE:
1. CPD is used to determine the dynamic power dissipation (PD in mW):
PD = CPD × VCC2 × fi + S (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V; S (CL × VCC2 × fo) = sum of the outputs.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
48-Pin Plastic SSOP Type III
–40
°C to +85°C
74ALVC16244 DL
AC16244 DL
SOT370-1
48-Pin Plastic TSSOP Type II
–40
°C to +85°C
74ALVC16244 DGG
AC16244 DGG
SOT362-1
48-Pin Plastic SSOP Type III
–40
°C to +85°C
74ALVCH16244 DL
ACH16244 DL
SOT370-1
48-Pin Plastic TSSOP Type II
–40
°C to +85°C
74ALVCH16244 DGG
ACH16244 DGG
SOT362-1


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