Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Material

Packaging

12

(.472)

embossed tape

4,000 pcs. per reel

Substrate

Alumina 96

Element

Ruthenium Oxide

Coating

Glass

Terminal

AgPb, Plated Ni+SnPb

REV. 04/06

CAT25 - Thick Film Chip Resistor Arrays

Soldering Profile for Lead Free Chip Resistors and Arrays

25

75

125

175

225

275

0

50

100

150

200

250

300

Time (seconds)

60 - 120 seconds

60 - 90

seconds

260 °C peak

190 °C

150 °C

220 °C

Ramp Down

3 °C/second

255 °C

Maximum of 20 seconds between

+255 °C and +260 °C

Ramp Up

3 °C/second maximum

10 seconds minimum

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