BCX17LT1, BCX18LT1, PNP BCX19LT1, NPN

http://onsemi.com

4

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AK

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

D

J

K

L

A

C

B S

H

G

V

3

1

2

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102

0.1197

2.80

3.04

INCHES

B

0.0472

0.0551

1.20

1.40

C

0.0350

0.0440

0.89

1.11

D

0.0150

0.0200

0.37

0.50

G

0.0701

0.0807

1.78

2.04

H

0.0005

0.0040

0.013

0.100

J

0.0034

0.0070

0.085

0.177

K

0.0140

0.0285

0.35

0.69

L

0.0350

0.0401

0.89

1.02

S

0.0830

0.1039

2.10

2.64

V

0.0177

0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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BCX17LT1/D

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