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TPA701DGNG4 датащи(PDF) 2 Page - Texas Instruments |
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TPA701DGNG4 датащи(HTML) 2 Page - Texas Instruments |
2 / 25 page TPA701 700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER SLOS229D – NOVEMBER1998 – REVISED MAY 2003 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 AVAILABLE OPTIONS PACKAGED DEVICES MSOP TA SMALL OUTLINE† (D) MSOP‡ (DGN) MSOP SYMBOLIZATION – 40 °C to 85°C TPA701D TPA701DGN ABA † In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long as the RMS value is less than 350 mW. ‡ The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA701DR). Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. I/O DESCRIPTION BYPASS 2 I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1- µF to 2.2-µF capacitor when used as an audio amplifier. GND 7 GND is the ground connection. IN – 4 I IN – is the inverting input. IN – is typically used as the audio input terminal. IN+ 3 I IN + is the noninverting input. IN + is typically tied to the BYPASS terminal. SHUTDOWN 1 I SHUTDOWN places the entire device in shutdown mode when held high (IDD = 1.5 nA). VDD 6 VDD is the supply voltage terminal. VO+ 5 O VO+ is the positive BTL output. VO– 8 O VO– is the negative BTL output. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§ Supply voltage, VDD 6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI –0.3 V to VDD +0.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation internally limited (see Dissipation Rating Table) . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature range, TA – 40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating junction temperature range, TJ – 40 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . § Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C D 725 mW 5.8 mW/ °C 464 mW 377 mW DGN 2.14 W¶ 17.1 mW/ °C 1.37 W 1.11 W ¶ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document. |
Аналогичный номер детали - TPA701DGNG4 |
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Аналогичное описание - TPA701DGNG4 |
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