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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS (Thermal Resistance = °C/W)

TPS2231

TPS2236

SLVS536E – JULY 2004 – REVISED SEPTEMBER 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

NUMBER OF CHANNELS

TSSOP

PowerPAD HTSSOP

QFN

TPS2231RGP

Single

TPS2231PW

TPS2231PWP

–40°C to 85°C

Dual

TPS2236DAP

(1)

The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2231PWPR).

(2)

The TPS2231MRGP is identical to the TPS2231RGP with the exception of the PowerPAD dimensions. See the Thermal Pad

Mechanical data portion of this data sheet for specific information.

TPS223x

UNIT

–0.3 to 6

V

Input voltage range for card

–0.3 to 6

V

power

–0.3 to 6

V

Logic input/output voltage

–0.3 to 6

V

–0.3 to 6

V

Output voltage range

–0.3 to 6

V

–0.3 to 6

V

Continuous total power dissipation

See Dissipation Rating Table

Internally limited

Output current

Internally limited

Internally limited

OC sink current

10

mA

PERST sink/source current

10

mA

Operating virtual junction temperature range

–40 to 120

°C

Storage temperature range

–55 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

TPS2231

2

kV

Human body model

TPS2236, all pins except

Electrostatic discharge

(HBM) MIL-STD-883C

PERSTx and OCx

ESD

protection

TPS2236, PERSTx and OCx

1.5

kV

Charge device model (CDM)

500

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

704.2 mW

7.41 mW/°C

370.6 mW

259.5 mW

3153 mW

33.19 mW/°C

1659.5 mW

1161.6 mW

(1)

These devices are mounted on an JEDEC low-k board (2-oz. traces on surface), (The table is assuming that the maximum junction

temperature is 120°C). The power pad on the device must be soldered down to the power pad on the board if best thermal performance

is needed.

2

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