поискавой системы для электроныых деталей |
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CS8371ET7G датащи(PDF) 9 Page - ON Semiconductor |
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CS8371ET7G датащи(HTML) 9 Page - ON Semiconductor |
9 / 11 page CS8371 http://onsemi.com 9 cause small signal oscillations at the output. This will depend on the load conditions. With these types of loads, a traditional output stage may be better suited for proper operation. Output 1 employs NOCAP. Refer to the plots in the Typical Performance Characteristics section for appropriate output capacitor selections for stability if an external capacitor is required by the switching characteristics of the load. Output 2 has a Darlington NPN−type output structure and is inherently stable with any type of capacitive load or no capacitor at all. Calculating Power Dissipation in a Dual Output Linear Regulator The maximum power dissipation for a dual output regulator (Figure 24) is PD(max) + VIN(max) * VOUT1(min) IOUT1(max) ) VIN(max) * VOUT2(min) IOUT2(max) ) VIN(max)IQ (1) where: VIN(max) is the maximum input voltage, VOUT1(min) is the minimum output voltage from VOUT1, VOUT2(min) is the minimum output voltage from VOUT2, IOUT1(max) is the maximum output current, for the application, IOUT2(max) is the maximum output current, for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: R qJA + 150 °C * TA PD (2) The value of RqJA can be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in equation 2 will keep the die temperature below 150 °C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. Figure 24. Dual Output Regulator With Key Performance Parameters Labeled. SMART REGULATOR ® Control Features VOUT1 IOUT1 VOUT2 IOUT2 VIN IIN IQ Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: R qJA + RqJC ) RqCS ) RqSA (3) where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heatsink thermal resistance, and RqSA = the heatsink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. PACKAGE THERMAL DATA Parameter TO−220 SEVEN LEAD Unit RqJC Typical 2.4 °C/W RqJA Typical 50 °C/W |
Аналогичный номер детали - CS8371ET7G |
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Аналогичное описание - CS8371ET7G |
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