поискавой системы для электроныых деталей |
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CAT3200ES6-5-TE7 датащи(PDF) 8 Page - Catalyst Semiconductor |
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CAT3200ES6-5-TE7 датащи(HTML) 8 Page - Catalyst Semiconductor |
8 / 12 page CAT3200/3200-5 8 Doc. No. 5002, Rev. K © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice APPLICATION INFORMATION Ceramic Capacitors Ceramic capacitors of different dielectric materials lose their capacitance with higher temperature and voltage at different rates. For example, a capacitor made of X5R or X7R material will retain most of its capacitance from – 40 °C to 85°C whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range. Z5U and Y5V capacitors may also have voltage coefficient causing them to lose 60% or more of their capacitance when the rated voltage is applied. When comparing different capacitors it is often useful consider the amount of achievable capacitance for a given case size rather than discussing the specified capacitance value. For example, over rated voltage and temperature conditions, a 1 µF, 10V, Y5V ceramic capacitor in an 0603 case may not provide any more capacitance than a 0.22 µF, 10V, X7R available in the same 0603 case. For many CAT3200/CAT3200-5 applications these capacitors can be considered roughly equivalent. The capacitor manufacturer’s data sheet should be consulted to determine what value of capacitor is needed to ensure the desired capacitance at all temperatures and voltages. Below is a list of ceramic capacitor manufacturers and how to contact them: Capacitor Manufacturer Web Phone Murata www.murata.com 814.237.1431 AVX/Kemet www.avxcorp.com 843.448.9411 Vishay www.vishay.com Kemet www.kemet.com 408.986.0424 Taiyo Yuden www.t-yuden.com 408.573.4150 Thermal Management For higher input voltages and maximum output current there can be substantial power dissipation in the CAT3200/CAT3200-5. If the junction temperature increases to 160 °C, the thermal shutdown circuitry will automatically turn off the output. A good thermal connection to the PC board is recommended to reduce the chip temperature. Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for CAT3200-5) to a ground plane, and maintaining a solid ground plane under the device reduces the overall thermal resistance. The overall junction to ambient thermal resistance ( θ JA) for device power dissipation (P D) consists primarily of two paths in series. The first path is the junction to the case ( θ JC) which is defined by the package style, and the second path is case to ambient ( θ CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: TT P P JUNC AMB D JC D CA =+ + () ( ) ΘΘ =+ TP AMB D JA () Θ The CAT3200 in SOT23 package, when mounted on printed circuit board with two square inches of copper allocated for “heat spreading”, will result with an overall θ JA of less than 150°C/W. For a typical application operating from a 3.8V input supply, the maximum power dissipation is 260mW (100mA x 3V). This would result if a maximum junction temperature of : T = T + P ( ) = 85 C + 0.26W (150 C/W) = 85 C + 39 C = 124 C JUNC AMB D JA θ °° °° ° The use of multi-layer board construction with power planes will further enhance the overall thermal performance. In the event of no dedicated copper area being used for heat spreading, a multi-layer board will typically provide the CAT3200 with an overall θ JA of 200 °C/W. This level of thermal conduction would allow up to 200mW be safely dissipated within the device. |
Аналогичный номер детали - CAT3200ES6-5-TE7 |
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Аналогичное описание - CAT3200ES6-5-TE7 |
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