1996 Sep 18

4

Not recommended for new designs

Philips Semiconductors

Product specification

Fast soft-recovery

controlled avalanche rectifiers

BYD31 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.11.

For more information please refer to the

“General Part of associated Handbook”.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

lead length = 10 mm

180

K/W

thermal resistance from junction to ambient

note 1

250

K/W