поискавой системы для электроныых деталей |
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FDS2670 датащи(PDF) 3 Page - Fairchild Semiconductor |
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FDS2670 датащи(HTML) 3 Page - Fairchild Semiconductor |
3 / 6 page FDS2670 Rev C1(W) Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°/W when mounted on a 1in 2 pad of 2 oz copper b) 105°/W when mounted on a 0.04 in 2 pad of 2 oz copper c) 125°/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% 3. ISD ≤ 3A, di/dt ≤ 100A/µs, VDD ≤ BVDSS, Starting TJ = 25°C |
Аналогичный номер детали - FDS2670_01 |
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Аналогичное описание - FDS2670_01 |
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