2004 Mar 10

8

Philips Semiconductors

Product specification

PNP general purpose transistors

BC857M series

PACKAGE OUTLINE

UNIT

max.

eL

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.50

0.46

0.20

0.12

0.55

0.47

0.03

0.62

0.55

0.35

0.65

DIMENSIONS (mm are the original dimensions)

Note

1. Including plating thickness

0.30

0.22

0.30

0.22

SOT883

SC-101

03-02-05

03-04-03

DE

1.02

0.95

L

E

2

3

1

b

b1

A1

A

D

L1

0

0.5

1 mm

scale

Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm

SOT883

e

e1