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LC25WZBJ-J59 датащи(PDF) 1 Page - Bookham, Inc. |
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LC25WZBJ-J59 датащи(HTML) 1 Page - Bookham, Inc. |
1 / 5 page Data Sheet 1 This laser module employs the Bookham strained layer MQW Buried Heterostructure DFB laser chip, and has been designed specifically for use in 2.5Gb/s long distance single channel optical fiber systems. The device is packaged in a hermetically sealed 14-pin butterfly package incorporating an isolator and monitor photodiode for control of the power of the laser over life and all operating conditions. Features: • 2.5Gb/s operation • Narrow spectral line-width • Internal TEC with precision NTC thermistor for temperature control • Code reduction with single product for reaches up to 175km • GaInAsP SLMQW DFB single frequency laser chip • InGaAs monitor Photodiode • Hermetically sealed 14-pin butterfly package with optical isolator • RoHS compliant Applications: • TDM • On-off ramps • Long-Haul 2.5Gb/s Buried Het Laser non-WDM applications LC25WZ |
Аналогичный номер детали - LC25WZBJ-J59 |
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Аналогичное описание - LC25WZBJ-J59 |
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