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FEATURES

A/B

3

2

5

8

1

A

B

GND

DCT PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

DCU PACKAGE

(TOP VIEW)

3

2

4

5

1

A

G

B

GND

B

GND

Y

Y

See mechanical drawings for dimensions.

2

5

3

4

8

Y

A/B

Y

Y

G

Y

4

6

7

6

7

8

6

1

7

A

A/B

G

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G157

SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER

SCES207K – APRIL 1999 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Typical V

NanoFree™ Package

>2 V at V

• Supports 5-V V

• I

Operation

• Inputs Accept Voltages to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

• Max t

JESD 78, Class II

• Low Power Consumption, 10-µA Max I

CC

• ESD Protection Exceeds JESD 22

• ±24-mA Output Drive at 3.3 V

–

2000-V Human-Body Model (A114-A)

• Typical V

–

1000-V Charged-Device Model (C101)

<0.8 V at V

The SN74LVC2G157 features a common strobe (G) input. When the strobe is high, Y is low and Y is high.

When the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The device

provides true and complementary data.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74LVC2G157YZPR

_ _ _C3_

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC2G157DCTR

C57_ _ _

–40°C to 85°C

Reel of 3000

SN74LVC2G157DCUR

VSSOP – DCU

C57_

Reel of 250

SN74LVC2G157DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.