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AD818 датащи(PDF) 4 Page - Analog Devices |
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AD818 датащи(HTML) 4 Page - Analog Devices |
4 / 16 page REV. C –4– AD818 ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Internal Power Dissipation 2 Plastic (N) . . . . . . . . . . . . . . . . . . . . . . See Derating Curves Small Outline (R) . . . . . . . . . . . . . . . . . See Derating Curves Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ±VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V Output Short-Circuit Duration . . . . . . . . See Derating Curves Storage Temperature Range (N, R) . . . . . . . . –65 ∞C to +125∞C Operating Temperature Range . . . . . . . . . . . . –40 ∞C to +85∞C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 ∞C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-lead plastic package, JA = 90 ∞C/W; 8-lead SOIC package, JA = 155 ∞C/W. ORDERING GUIDE Model Temperature Range Package Description Package Option AD818AN –40 ∞C to +85∞C 8-Lead Plastic PDIP N-8 AD818AR –40 ∞C to +85∞C 8-Lead Plastic SOIC R-8 AD818AR-REEL –40 ∞C to +85∞C 13" Tape and Reel R-8 AD818AR-REEL7 –40 ∞C to +85∞C 7" Tape and Reel R-8 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD818 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. 2.0 0 –50 90 1.5 0.5 –30 1.0 50 70 30 10 –10 80 –40 40 60 20 0 –20 AMBIENT TEMPERATURE ( C) 8-LEAD MINI-DIP PACKAGE 8-LEAD SOIC PACKAGE TJ = 150 C Figure 3. Maximum Power Dissipation vs. Temperature for Different Package Types METALLIZATION PHOTOGRAPH Dimensions shown in inches and (mm) –INPUT 2 +INPUT 3 6 OUTPUT 4 –VS +VS 7 OFFSET NULL 8 OFFSET NULL 1 0.0559 (1.42) 0.0523 (1.33) |
Аналогичный номер детали - AD818 |
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Аналогичное описание - AD818 |
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