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L6382D5 датащи(PDF) 4 Page - STMicroelectronics

номер детали L6382D5
подробное описание детали  Power management unit for microcontrolled ballast
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

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Pin settings
L6382D5
4/21
2
Pin settings
2.1
Pin connection
Figure 3.
Pin connection (top view)
2.2
Pin description
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PFI
LSI
HSI
HEI
PFG
N.C.
TPR
GND
LSG
VCC
VREF
CSI
CSO
HEG
N.C.
HVSU
N.C.
OUT
HSG
BOOT
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PFI
LSI
HSI
HEI
PFG
N.C.
TPR
GND
LSG
VCC
VREF
CSI
CSO
HEG
N.C.
HVSU
N.C.
OUT
HSG
BOOT
Table 1. Pin description
Name
Pin N°
Description
1PFI
Digital input signal to control the PFC gate driver. This pin has to be connected
to a 5V CMOS compatible signal.
2LSI
Digital input signal to control the half-bridge low side driver. This pin has to be
connected to a 5V CMOS compatible signal.
3HSI
Digital input signal to control the half-bridge high side driver. This pin has to be
connected to a 5V CMOS compatible signal.
4HEI
Digital input signal to control the HEG output. This pin has to be connected to a
5V CMOS compatible signal.
5PFG
PFC Driver Output. This pin must be connected to the PFC power MOSFET
gate. A resistor connected between this pin and the power MOS gate can be
used to reduce the peak current. An internal 10K
Ω resistor toward ground
avoids spurious and undesired MOSFET turn-on
The totem pole output stage is able to drive the power MOS with a peak
current of 120mA source and 250mA sink.
6
N.C.
Not connected
7TPR
Input for two point regulator; by coupling the pin with a capacitor to a switching
circuit, it is possible to implement a charge circuit for the Vcc.
8GND
Chip ground. Current return for both the low-side gate-drive currents and the
bias current of the IC. All of the ground connections of the bias components
should be tied to a track going to this pin and kept separate from any pulsed
current return.


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