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KMPC860SRZQ66D4 датащи(PDF) 9 Page - Freescale Semiconductor, Inc |
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KMPC860SRZQ66D4 датащи(HTML) 9 Page - Freescale Semiconductor, Inc |
9 / 80 page MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8 Freescale Semiconductor 9 Thermal Characteristics Table 4 shows the thermal characteristics for the MPC860. Table 4. MPC860 Thermal Resistance Data Rating Environment Symbol ZP MPC860P ZQ / VR MPC860P Unit Mold Compound Thickness 0.85 1.15 mm Junction-to-ambient 1 1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. Natural convection Single-layer board (1s) RθJA 2 2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. 34 34 •C/W C/W Four-layer board (2s2p) RθJMA 3 3 Per JEDEC JESD51-6 with the board horizontal. 22 22 Airflow (200 ft/min) Single-layer board (1s) RθJMA 3 27 27 Four-layer board (2s2p) RθJMA 3 18 18 Junction-to-board 4 4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 14 13 Junction-to-case 5 5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the exposed pad without contact resistance. RθJC 68 Junction-to-package top 6 6 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. Natural convection ΨJT 22 |
Аналогичный номер детали - KMPC860SRZQ66D4 |
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Аналогичное описание - KMPC860SRZQ66D4 |
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