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74AUC1G240DBVRE4 датащи(PDF) 1 Page - Texas Instruments

номер детали 74AUC1G240DBVRE4
подробное описание детали  SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

74AUC1G240DBVRE4 датащи(HTML) 1 Page - Texas Instruments

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FEATURES
V
CC
V
CC
3
2
4
5
1
OE
Y
A
GND
DBVPACKAGE
(TOP VIEW)
3
2
4
5
1
OE
V
CC
Y
A
GND
OE
GND
Y
A
Seemechanicaldrawingsfordimensions.
1
4
2
3
5
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AUC1G240
SINGLE BUFFER/DRIVER
WITH 3-STATE OUTPUT
SCES384I – MARCH 2002 – REVISED FEBRUARY 2007
• Available in the Texas Instruments
• Low Power Consumption, 10-µA Max I
CC
NanoFree™ Package
• ±8-mA Output Drive at 1.8 V
• Optimized for 1.8-V Operation and Is 3.6-V I/O
• Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
• ESD Protection Exceeds JESD 22
• I
off Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
• Sub-1-V Operable
1000-V Charged-Device Model (C101)
• Max t
pd of 2.5 ns at 1.8 V
This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC1G240YZPR
_ _ _UK_
0.23-mm Large Bump – YZP (Pb-free)
–40
°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74AUC1G240DBVR
U40_
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G240DCKR
UK_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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