© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5099 Rev. 1.1.5

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Absolute maximum ratings apply individually only, not in combina-

tion. Unless otherwise specified, all other voltages are referenced to AGND.

Thermal Information

Notes:

1. Junction-to-ambient thermal resistance,

θ

number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat

sink characteristics.

Parameter

Min.

Max.

Unit

VCC to GND

Continuous

6.0

V

BOOT to GND

Continuous

-0.3

33

V

Transient (t < 100ns, f < 500kHz)

-0.5

35

V

BOOT to SW

Continuous

-0.5

6.0

V

Transient (t < 50ns, f < 500kHz)

-2.5

V

SW to GND

Continuous

-0.5

33.0

V

Transient (t < 50ns, f < 500kHz)

-3.0

35.0

V

HDRV to SW

Continuous

-0.5

6.0

V

Transient (t < 40ns, f < 500kHz)

-2.5

V

LDRV to PGND

Continuous

-0.5

6.0

V

Transient (t < 40ns, f < 500kHz)

-2.5

V

All Other Pins

Continuous

-0.3

V

Maximum Shunt Current

150

mA

Electrostatic Discharge (ESD) Protection Level

Human Body Model

(Mil Std. 883E, Method 3015.7)

3.5

kV

Charged Device Model

(EIA/JESD22C101-A)

1.8

Symbols

Parameter

Min.

Typ.

Max.

Unit

Storage Temperature

-65

+150

°C

Lead Soldering Temperature, 10 Seconds

+300

°C

Vapor Phase, 60 Seconds

+215

°C

Infrared, 15 Seconds

+220

°C

715

mW

θ

JC

Thermal Resistance – Junction-to-Case

37

°C/W

θ

JA

100

°C/W