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SI5481DU-T1-GE3 датащи(PDF) 1 Page - Vishay Siliconix |
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SI5481DU-T1-GE3 датащи(HTML) 1 Page - Vishay Siliconix |
1 / 7 page Vishay Siliconix Si5481DU New Product Document Number: 73777 S-81448-Rev. C, 23-Jun-08 www.vishay.com 1 P-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) RDS(on) (Ω)ID (A) Qg (Typ.) - 20 0.022 at VGS = - 4.5 V - 12a 20 nC 0.029 at VGS = - 2.5 V - 12a 0.041 at VGS = - 1.8 V - 12a Notes: a. Package limited. b. Surface mounted on 1" x 1" FR4 board. c. t = 5 s. d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 90 °C/W. ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Limit Unit Drain-Source Voltage VDS - 20 V Gate-Source Voltage VGS ± 8 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID - 12a A TC = 70 °C - 12a TA = 25 °C - 9.7b, c TA = 70 °C - 7.8b, c Pulsed Drain Current IDM - 20 Continuous Source-Drain Diode Current TC = 25 °C IS - 14.8 TA = 25 °C - 2.6b, c Maximum Power Dissipation TC = 25 °C PD 17.8 W TC = 70 °C 11.4 TA = 25 °C 3.1b, c TA = 70 °C 2b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C Soldering Recommendations (Peak Temperature)d, e 260 THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f t ≤ 5 s RthJA 30 40 °C/W Maximum Junction-to-Case (Drain) Steady State RthJC 5.5 7 Marking Code BC XXX Lot Traceability and Date Code Part # Code S G D P-Channel MOSFET Ordering Information: Si5481DU-T1-GE3 (Lead (Pb)-free and Halogen-free) Bottom View PowerPAK ChipFET Single D D D G 1 2 8 7 6 5 D D D S 3 4 S RoHS COMPLIANT FEATURES • Halogen-free •TrenchFET® Power MOSFET • New thermally Enhanced PowerPAK® ChipFET® Package - Small Footprint Area - Low On-Resistance - Thin 0.8 mm Profile APPLICATIONS • Load Switch, Battery Switch, PA Switch and Charger Switch for Portable Devices |
Аналогичный номер детали - SI5481DU-T1-GE3 |
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Аналогичное описание - SI5481DU-T1-GE3 |
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