PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TPS3307-18D

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TPS3307-18DGN

ACTIVE

MSOP-

Power

PAD

DGN

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-18DGNR

ACTIVE

MSOP-

Power

PAD

DGN

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-18DR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TPS3307-18DRG4

PREVIEW

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS3307-25D

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TPS3307-25DGN

ACTIVE

MSOP-

Power

PAD

DGN

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-25DGNR

ACTIVE

MSOP-

Power

PAD

DGN

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-25DGNRG4

ACTIVE

MSOP-

Power

PAD

DGN

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS3307-25DR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TPS3307-25DRG4

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS3307-33D

ACTIVE

SOIC

D

8

75

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-33DGN

ACTIVE

MSOP-

Power

PAD

DGN

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-33DGNR

ACTIVE

MSOP-

Power

PAD

DGN

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-33DR

ACTIVE

SOIC

D

8

2500

None

CU NIPDAU

Level-1-220C-UNLIM

TPS3307-33DRG4

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

PACKAGE OPTION ADDENDUM

www.ti.com

4-Mar-2005

Addendum-Page 1