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UC3173A датащи(PDF) 2 Page - Texas Instruments |
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UC3173A датащи(HTML) 2 Page - Texas Instruments |
2 / 12 page 2 UC3173A Input Supply Voltage, (VIN, VC, VL) . . . . . . . . . . . . . . . . . . 20V UV Comparator Maximum Forced Voltage . . . . . . . . . . . . . . . . −0.3V to 10V Maximum Forced Current . . . . . . . . . . . . . . . . . . . . . ± 10mA B Amplifier Inverting Input . . . . . . . . . . . . . . −0.3V to VIN + 1.0 A Amplifier Inverting Inputs, (Aux. and Normal) . . . . . . . . . . . . . . . . . −0.3V to VC + 1.0V Open Collector Output Voltages . . . . . . . . . . . . . . . . . . . . . 20V A and B Output Currents (Continuous) Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6A Parking Drive Output Current Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mA Pulsed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A Output Diode Current (Pulsed) . . . . . . . . . . . . . . . . . . . . . . 0.6A Power OK Output Current (Continuous) . . . . . . . . . . . . . . 30mA Operating Junction Temperature . . . . . . . . . . −55°C to +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300 °C Note 1: Unless otherwise indicated, voltages are referenced to ground and currents are positive into, negative out of, the speci- fied terminals, “Pulsed” is defined as a less than 10% duty cycle pulse with a maximum duration of 500 µs. ABSOLUTE MAXIMUM RATINGS (Note 1) DW Package: Thermal Resistance Junction to Leads, θjl . . . . . . . . 35°C/W Thermal Resistance Junction to Ambient, θja . . . . 60-70°C/W FQ Package: Thermal Resistance Junction to Leads, θjl . . . . . . . . . 60°C/W Thermal Resistance Junction to Ambient, θja . . 110-120°C/W QP Package: Thermal Resistance Junction to Leads, θjl . . . . . . . . . 15°C/W Thermal Resistance Junction to Ambient, θja . . . . 30-40°C/W Note 2: The above numbers for θjl are maximums for the limiting thermal resistance of the package in a standard mounting con- figuration. The θja numbers are meant to be guide lines for the thermal performance of the device/pc-board system. All of the above numbers assume no ambient airflow. Note 3: Consult Packaging Section of Unitrode Integrated Cir- cuits databook for thermal specifications and limitations of pack- ages. THERMAL DATA SOIC-24 (Top View) DW Package PLCC-28 (Top View) QP Package 48 47 46 45 1 44 43 42 41 40 39 38 37 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 36 35 34 33 32 31 30 29 28 27 26 25 N/C N/C VIN BIN N/C N/C PRKDRV PWROK REFIN N/C N/C N/C BOUT BOUT N/C N/C N/C AOUT AOUT N/C N/C N/C AIN VC RANGE CS+ COMP VPARK N/C GND CSOUT VL INH N/C UV1 UV2 PARK PGND N/C PGND CS– N/C N/C N/C N/C N/C N/C N/C CONNECTION DIAGRAMS TQFP-48 (Top View) FQ Package |
Аналогичный номер детали - UC3173A |
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Аналогичное описание - UC3173A |
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