ISL12057IBZ datasheet(4/17 Pages) INTERSIL

номер детали	ISL12057IBZ

подробное описание детали	Low Cost and Low Power I2C RTC Real Time Clock/Calendar

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производитель	INTERSIL [Intersil Corporation]

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4 / 17 page

4

FN6755.0

June 15, 2009

Absolute Maximum Ratings

Thermal Information

Voltage on VDD (respect to GND) . . . . . . . . . . . . . . . . . . -0.2V to 4V

Voltage on IRQ1/FOUT, IRQ2, SCL and SDA

(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V

Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V

ESD Rating ((Per MIL-STD-883 Method 3014)

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV

Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V

Thermal Resistance (Typical)

θJA (°C/W)

8 Lead SOIC (Note 3) . . . . . . . . . . . . . . . . . . . . . . .

120

8 Lead MSOP (Note 3). . . . . . . . . . . . . . . . . . . . . . .

169

8 Lead µTDFN (Note 3) . . . . . . . . . . . . . . . . . . . . . .

160

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

3.

θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.

SYMBOL

PARAMETER

CONDITIONS

MIN

(Note 6)

TYP

(Note 5)

MAX

(Note 6)

UNITS

NOTES

VDD

Full Operation Power Supply

1.8

3.6

V

VDDT

Timekeeping Power Supply

1.4

1.8

V

IDD1

Standby Supply Current

VDD = 3.6V

600

950

nA

4, 10

VDD = 3.3V

500

nA

IDD2

Timekeeping Current

VDD = 1.8V

400

650

nA

4, 10

VDD = 1.6V

350

nA

IDD3

Supply Current With I2C Active at Clock

Speed of 400kHz

VDD = 3.6V

15

40

µA

4

ILI

Input Leakage Current on SCL

-100

100

nA

ILO

I/O Leakage Current on SDA

-100

100

nA

IRQ1/FOUT and IRQ2

VOL

Output Low Voltage

VDD = 1.8V, IOL = 3mA

0.4

V

Serial Interface Specifications

Over the recommended operating conditions unless otherwise specified.

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

(Note 6)

TYP

(Note 5)

MAX

(Note 6)

UNITS NOTES

SERIAL INTERFACE SPECS

VIL

SDA and SCL Input Buffer LOW

Voltage

-0.3

0.3 x VDD

V

VIH

SDA and SCL Input Buffer HIGH

Voltage

0.7 x VDD

5.5

V

Hysteresis SDA and SCL Input Buffer

Hysteresis

0.04 x VDD

V

VPULLUP Maximum Pull-up voltage on

SDA during I2C communication

VDD + 2

V

9

VOL

SDA Output Buffer LOW Voltage,

Sinking 3mA

VDD > 1.8V, VPULLUP = 5.0V

0

0.4

V

Cpin

SDA and SCL Pin Capacitance

TA = +25°C, f = 1MHz, VDD = 5V,

VIN =0V, VOUT = 0V

10

pF

7, 8

fSCL

SCL Frequency

400

kHz

tIN

Pulse width Suppression Time at

SDA and SCL Inputs

Any pulse narrower than the max spec

is suppressed.

50

ns

tAA

SCL Falling Edge to SDA Output

Data Valid

SCL falling edge crossing 30% of VDD,

until SDA exits the 30% to 70% of VDD

window.

900

ns

9

ISL12057

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