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REV. D

(5) Power dissipation(Pd)

If the IC is used under excessive power dissipation. An increase in the chip temperature will cause

deterioration of the radical characteristics of IC.

For example, reduction of current capability. Take consideration of the effective power dissipation and thermal

design with a sufficient margin. Pd is reference to the provided power dissipation curve.

(6) Short circuits between pins and incorrect mounting

Short circuits between pins and incorrect mounting when mounting the IC on a printed circuits board,

take notice of the direction and positioning of the IC.

If IC is mounted erroneously, It may be damaged. Also, when a foreign object is inserted between

output, between output and VCC terminal or VEE terminal which causes short circuit, the IC may be damaged.

(7) Using under strong electromagnetic field

Be careful when using the IC under strong electromagnetic field because it may malfunction.

(8) Usage of IC

When stress is applied to the IC through warp of the printed circuit board,

The characteristics may fluctuate due to the piezo effect.

Be careful of the warp of the printed circuit board.

(9) Output operation

This IC is configured with a push-pull circuit and Class C output stage. Therefore, when load resistance

is connected to the middle point potential of VCC and VEE, this configuration generates crossover

distortion when switching between source and sink current.

To suppress crossover distortion, connect a resistor between the output terminal and VEE then increase

the bias current to enable Class A operation.

(10) Testing IC on the set board

When testing IC on the set board, in cases where the capacitor is connected to the low impedance,

make sure to discharge per fabrication because there is a possibility that IC may be damaged by stress.

When removing IC from the set board, it is essential to cut supply voltage.

As a countermeasure against the static electricity, observe proper grounding during fabrication process

and take due care when carrying and storage it.

(12) The IC destruction caused by capacitive load

The transistors in circuits may be damaged when VCC terminal and VEE terminal is shorted with the charged

output terminal capacitor.

When IC is used as a comparator or as application circuits no constructed negative feed back,

where oscillation is not activated by an output capacitor, the output capacitor must be kept below

0.1[μF] in order to prevent the damage mentioned above.

(13) The oscillation caused by capacitive load

Designed negative feedback circuit using this IC, verify output oscillation caused by capacitive load.