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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADV3227-EVALZ датащи(PDF) 7 Page - Analog Devices |
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ADV3227-EVALZ датащи(HTML) 7 Page - Analog Devices |
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7 / 24 page  ADV3226/ADV3227 Rev. 0 | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating Analog Supply Voltage (AVCC − AVEE) 11 V Digital Supply Voltage (DVCC − DGND) 6 V Supply Potential Difference (AVCC − DVCC) ±0.5 V Ground Potential Difference (AGND − DGND) ±0.5 V Maximum Potential Difference (DVCC − AVEE) 6 V Analog Input Voltage AVEE < VIN < AVCC Digital Input Voltage DGND < DIN < DVCC Exposed Paddle Voltage AVEE < VIN < AVCC Output Voltage (Disabled Analog Output) AVEE < VOUT < AVCC Output Short-Circuit Duration Momentary Current Internally limited to 55 mA Temperature Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Junction Temperature 150°C Lead Temperature (Soldering, 10 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 6. Thermal Resistance Package Type θJA θJC θJB ψJT ψJB Unit 100-Lead LFCSP 26 2.56 9.5 0.2 8.9 °C/W POWER DISSIPATION The ADV3226/ADV3227 operate with ±5 V supplies and can drive loads down to 100 Ω, resulting in a wide range of possible power dissipations. For this reason, extra care must be taken when derating the operating conditions based on ambient temperature. Packaged in the 100-lead LFCSP, the ADV3226/ADV3227 junction-to-ambient thermal impedance (θJA) is 26°C/W. For long-term reliability, the maximum allowed junction temperature of the die should not exceed 125°C; even temporarily exceeding this limit can cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Exceeding a junction temperature of 150°C for an extended period can result in device failure. In Figure 4, the curve shows the range of allowed internal die power dissipation that meets these conditions over the −40°C to +85°C ambient temperature range. When using Figure 4, do not include the external load power in the maximum power calculation, but do include the load current dropped on the die output transistors. 6 5 4 3 2 15 25 35 45 55 65 75 85 AMBIENT TEMPERATURE (°C) TJ = 150°C Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature ESD CAUTION |
Аналогичный номер детали - ADV3227-EVALZ |
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Аналогичное описание - ADV3227-EVALZ |
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