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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP886XMB1-EVALZ датащи(PDF) 5 Page - Analog Devices |
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ADP886XMB1-EVALZ датащи(HTML) 5 Page - Analog Devices |
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5 / 40 page  ADP8861 Rev. 0 | Page 5 of 40 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VIN, VOUT −0.3 V to +6 V D1, D2, D3, D4, D5, D6, and D7 −0.3 V to +6 V nINT, nRST, SCL, and SDA −0.3 V to +6 V Output Short-Circuit Duration Indefinite Operating Temperature Range Ambient (TA) –40°C to +85°C1 Junction (TJ) –40°C to +125°C Storage Temperature Range –65°C to +150°C Soldering Conditions JEDEC J-STD-020 ESD (Electrostatic Discharge) Human Body Model (HBM) ±3 kV Charged Device Model (CDM) ±1.5 kV 1 The maximum operating junction temperature (TJ(MAX)) takes precedence over the maximum operating ambient temperature (TA(MAX)). See the Maximum Temperature Ranges section for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all voltages are referenced to ground. MAXIMUM TEMPERATURE RANGES The maximum operating junction temperature (TJ(MAX)) takes precedence over the maximum operating ambient temperature (TA(MAX)). Therefore, in situations where the ADP8861 is exposed to poor thermal resistance and high power dissipation (PD), the maximum ambient temperature may need to be derated. In these cases, the maximum ambient temperature can be calculated with the following equation: TA(MAX) = TJ(MAX) − (θJA × PD(MAX)) THERMAL RESISTANCE θJA (junction to air) is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. The θJA and θJC (junction to case) are determined according to JESD51-9 on a 4-layer printed circuit board (PCB) with natural convection cooling. For the LFCSP package, the exposed pad must be soldered to the GND1 and/or GND2 terminal on the board. Table 3. Thermal Resistance Package Type θJA θJC Unit 20-Lead LFCSP_WQ 49.5 5.3 °C/W ESD CAUTION |
Аналогичный номер детали - ADP886XMB1-EVALZ |
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Аналогичное описание - ADP886XMB1-EVALZ |
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