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CSD86350Q5D датащи(PDF) 9 Page - Texas Instruments |
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CSD86350Q5D датащи(HTML) 9 Page - Texas Instruments |
9 / 15 page PWM ENABLE PWM GND BST DRVH LL DRVL CSD86350Q5D Driver IC V DD GateDrive Current(I ) DD InputCurrent(I ) IN InputVoltage(V ) IN OutputCurrent(I ) OUT T GR V IN P GND V I V O V SW T G B G GateDrive Voltage(V ) DD V DD A A V V V Control FET Sync FET Averaging Circuit AveragedSwitched NodeVoltage (V SW_AVG) A S0475-01 CSD86350Q5D www.ti.com SLPS223A – MAY 2010 – REVISED MAY 2010 APPLICATION INFORMATION The CSD86350Q5D NexFET™ power block is an optimized design for synchronous buck applications using 5V gate drive. The Control FET and Sync FET silicon are parametrically tuned to yield the lowest power loss and highest system efficiency. As a result, a new rating method is needed which is tailored towards a more systems centric environment. System level performance curves such as Power Loss, Safe Operating Area, and normalized graphs allow engineers to predict the product performance in the actual application. Power Loss Curves MOSFET centric parameters such as RDS(ON) and Qgd are needed to estimate the loss generated by the devices. In an effort to simplify the design process for engineers, Texas Instruments has provided measured power loss performance curves. Figure 1 plots the power loss of the CSD86350Q5D as a function of load current. This curve is measured by configuring and running the CSD86350Q5D as it would be in the final application (see Figure 28).The measured power loss is the CSD86350Q5D loss and consists of both input conversion loss and gate drive loss. Equation 1 is used to generate the power loss curve. (VIN x IIN) + (VDD x IDD) – (VSW_AVG x IOUT) = Power Loss (1) The power loss curve in Figure 1 is measured at the maximum recommended junction temperatures of 125°C under isothermal test conditions. Safe Operating Curves (SOA) The SOA curves in the CSD86350Q5D data sheet provides guidance on the temperature boundaries within an operating system by incorporating the thermal resistance and system power loss. Figure 3 to Figure 5 outline the temperature and airflow conditions required for a given load current. The area under the curve dictates the safe operating area. All the curves are based on measurements made on a PCB design with dimensions of 4” (W) x 3.5” (L) x 0.062” (T) and 6 copper layers of 1 oz. copper thicknes Normalized Curves The normalized curves in the CSD86350Q5D data sheet provides guidance on the Power Loss and SOA adjustments based on their application specific needs. These curves show how the power loss and SOA boundaries will adjust for a given set of systems conditions. The primary Y-axis is the normalized change in power loss and the secondary Y-axis is the change is system temperature required in order to comply with the SOA curve. The change in power loss is a multiplier for the Power Loss curve and the change in temperature is subtracted from the SOA curve. Figure 28. Typical Application Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 9 |
Аналогичный номер детали - CSD86350Q5D |
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Аналогичное описание - CSD86350Q5D |
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