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SN74AUP1G06DBVT датащи(PDF) 2 Page - Texas Instruments

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номер детали SN74AUP1G06DBVT
подробное описание детали  LOW-POWER SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

SN74AUP1G06DBVT датащи(HTML) 2 Page - Texas Instruments

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AUP
LVC
AUP
AUP
LVC
Static-PowerConsumption
( A)
m
Dynamic-PowerConsumption
(pF)
Single,dual,andtriplegates
3.3-V
Logic
0%
20%
40%
60%
80%
100%
0%
20%
40%
60%
80%
100%
3.3-V
Logic
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
15
20
25
30
35
40
45
Time-ns
AUP1G08dataatC =15pF
L
Output
Input
SwitchingCharacteristics
at25MHz
A
Y
2
4
SN74AUP1G06
SCES590D – JULY 2004 – REVISED MAY 2010
www.ti.com
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2).
Figure 1. AUP – The Lowest-Power Family
Figure 2. Excellent Signal Integrity
The output of this single inverter buffer/driver is open drain, and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G06YFPR
_ _ _HT_
0.23-mm Large Bump – YFP
QFN – DRY
Reel of 5000
SN74AUP1G06DRYR
HT
uQFN – DSF
Reel of 5000
SN74AUP1G06DSFR
HT
–40°C to 85°C
Reel of 3000
SN74AUP1G06DBVR
SOT (SOT-23) – DBV
H06_
Reel of 250
SN74AUP1G06DBVT
Reel of 3000
SN74AUP1G06DCKR
SOT (SC-70) – DCK
HT_
Reel of 250
SN74AUP1G06DCKT
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT
OUTPUT
A
Y
H
L
L
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
2
Submit Documentation Feedback
Copyright © 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1G06


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