11

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6679.0

March 24, 2008

ISL22512

Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)

6

B

E

A

D

0.10 C

2X

2

0.10 M C A B

0.05 M C

(ND-1) X e

C

0.05 C

A

0.10 C

A1

SEATING PLANE

e

INDEX AREA

PIN #1 ID

3

5

(DATUM A)

(DATUM B)

N-1

1

N

NX L

NX b

2

1

N

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NX (b)

SECTION "C-C"

FOR ODD TERMINAL/SIDE

e

CC

5

C

L

TERMINAL TIP

(A1)

L

DETAIL “A” PIN 1 ID

L

0.05 MIN

0.10 MIN

0.10 C

2X

4xk

b

L10.2.1x1.6A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC

PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

5

D

2.05

2.10

2.15

-

E

1.55

1.60

1.65

-

e

0.50 BSC

-

k0.20

--

-

L

0.35

0.40

0.45

-

N10

2

Nd

4

3

Ne

1

3

θ

0-

12

4

Rev. 3 6/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on D and E side,

respectively.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. Same as JEDEC MO-255UABD except:

No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm

"L" MAX dimension = 0.45 not 0.42mm.

10. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.

2.00

0.80

1.75

0.25

0.50

0.275

2.50

LAND PATTERN 10