поискавой системы для электроныых деталей |
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ESD33DT5G датащи(PDF) 1 Page - ON Semiconductor |
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ESD33DT5G датащи(HTML) 1 Page - ON Semiconductor |
1 / 4 page © Semiconductor Components Industries, LLC, 2008 February, 2008 - Rev. 2 1 Publication Order Number: mESD3.3DT5G/D mESD3.3DT5G SERIES ESD Protection Diodes In Ultra Small SOT-723 Package The mESD Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specification Features: • Small Body Outline Dimensions: 0.047 ″ x 0.032″ (1.20 mm x 0.80 mm) • Low Body Height: 0.020″ (0.5 mm) • Stand-off Voltage: 3.3 V - 6.0 V • Low Leakage • Response Time is Typically < 1 ns • ESD Rating of Class 3 (> 16 kV) per Human Body Model • IEC61000-4-2 Level 4 ESD Protection • IEC61000-4-4 Level 4 EFT Protection • These are Pb-Free Devices Mechanical Characteristics: CASE: Void‐free, transfer‐molded, thermosetting plastic Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260 °C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000-4-2 (ESD) Air Contact ±30 ±30 kV IEC 61000-4-4 (EFT) 40 A ESD Voltage Per Human Body Model Per Machine Model 16 400 kV V Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25°C Derate above 25 °C Thermal Resistance Junction-to-Ambient ⎪ PD RqJA 240 1.9 525 mW mW/ °C °C/W Junction and Storage Temperature Range TJ, Tstg -55 to +150 °C Lead Solder Temperature - Maximum (10 Second Duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in. 1 3 2 PIN 1. CATHODE 2. CATHODE 3. ANODE Device Package Shipping† ORDERING INFORMATION mESDxxDT5G SOT-723 8000/Tape & Reel MARKING DIAGRAM See specific marking information in the device marking column of the table on page 2 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com SOT-723 CASE 631AA STYLE 4 3 2 1 xx = Device Code M = Date Code xx M †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
Аналогичный номер детали - ESD33DT5G_08 |
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Аналогичное описание - ESD33DT5G_08 |
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