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FDS2570 датащи(PDF) 10 Page - Fairchild Semiconductor

номер детали FDS2570
подробное описание детали  Power Converter Topology and MOSFET Selection for 48-V Telecom
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производитель  FAIRCHILD [Fairchild Semiconductor]
домашняя страница  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDS2570 датащи(HTML) 10 Page - Fairchild Semiconductor

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10
Rev. A, June 2001
©2001 Fairchild Semiconductor Corporation
Table 1 shows the comparison of the topologies that have been discussed. Note that the rela-
tive cost increases significantly based on whether there is input/output isolation. Efficiency can
range from 70 to 85%. A summary of the first-pass selection of key MOSFET parameters is
shown in Table 2. Parameters of the MOSFETS used in Application Note are shown in Table 3.
Table 1: Comparison of various switching regulator topologies.
Table 2: Power MOSFET voltage and current ratings versus power supply topology.
Table 3: PowerTrench® MOSFETs in SO-8 package for 48V Applications.
Synchronous rectification.
Synchronous rectification may be employed with all the previously mentioned topologies. This
technique consists of replacing the output rectifiers with MOSFETs, striving to lower conduc-
tion losses. The concept is, however, not without its share of problems. The complexity of the
drive and control circuitry increases dramatically. Timing of the gate-drive to the synchronous
FETs is critical to avoid cross conduction. The parasitic capacitances and body diode reverse
recovery characteristics of the output FETs contribute to substantial switching losses in these
devices. The technique is most applicable for 12V and lower output voltages. The lower the
output voltage, the greater the advantage of synchronous rectification. Much above the 12V
level, the large parasitic losses make the approach much less advantageous.
Thermal Considerations
One of the main limiting factors in any power supply design is the ability to keep the junction
temperatures of the power devices within specified limits. When using surface-mount power
devices the primary heat sink is the PC board. The main constituents of PCBs are fiberglass
Topology
Max. Power
(Watts)
Typical
Efficiency (%)
Flyback
30
75
1 Transistor Forward
150
80
2 Transistor Forward
200
83
Push Pull
350
80
Full Bridge
500
85
Topology
Maximum Drain Voltage
Average Drain Current
Flyback
1.5Vin(max)
751.5Pout/ Vin(max)
1 Transistor Forward
2.5 to 3.0 Vin(max)
1.3Pout/ Vin(max)0
2 Transistor Forward
Vin(max)
1.2Pout/ Vin(max)
Push Pull
352.5 to 3.0 Vin(max)0
0.65Pout/ Vin(max)
Full Bridge
Vin(max)
0.60Pout/ Vin(max)
Voltage(DS)
Current (ID max)
ON-Resistance
(@VGS=10V)
FDS3570
80V
9 A
20 m
FDS3670
100V
6.3A
32 m
FDS2570
150V
4 A
80 m
FDS2670
200V
3 A
130 m


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