SPI-335-34

No.6029 2/6

Package dimensions and Pin connection

As stated in the sttached paper. (No.6029 5/6)

Rank marking of collector output

The bottom of the package is colored following the table of classification of collector output.

Lot marking

Color division shall be done as shown in the drawing. (Fig. 2)

Year of even number

: Front side

Year of odd number

: Back side

Color

Black

Blue

Red

Green

Orange

Brown

Part ‘A’

January

February

March

April

May

June

Part ‘B’

July

August

September

October

November

December

Soldering conditions

(1) Temperature

: Max. 260

°C

(2) Time

: Max. 3sec

(3) Clearance

: Min. 1mm from the case edge. (Fig. 3)

(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.

q Bending a lead must be done before soldering.

w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that

stress for the regin part cause troubles such as gold wire breaking and so on.

e A lead must be bend at intervals of 2mm from the case edge.

r Do not bend the same position of leads more than twice.

(2) The hole pitch of a circuit board must fit to the lead pitch.

(3) Take core the following when soldering.

q Do not heat a product under any stress (a twist and so on) to leads.

w Do not heat a product in the states of operating force to the regin part.

(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.

(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.

PRECAUTIONS

A

Front side

B

Fig. 2

Fig. 3