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SPI-336-99-T1 датащи(PDF) 5 Page - Sanyo Semicon Device

номер детали SPI-336-99-T1
подробное описание детали  Ultraminiature photoreflector supporting reflow soldering Single transistor type
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производитель  SANYO [Sanyo Semicon Device]
домашняя страница  https://www.sanyo-av.com/us/
Logo SANYO - Sanyo Semicon Device

SPI-336-99-T1 датащи(HTML) 5 Page - Sanyo Semicon Device

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SPI-336-99-T1
No.6030 5/6
Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
Temperature
: On the topsurface of product
Reflow type
: Hot air
(2) Manusl soldering
Temperature
: Max. 290
°C (Soldering iron tip temperature)
Time
: Max. 3 sec
Clearance
: Min. 0.5mm from package
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
: 5 to 30
°C
Humidity
: Max 70%RH
Term
: Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions
: +60
±5°C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
PRECAUTIONS
Max 240
°C
200
°C
Max 165
°C
Max 120sec
Max 10sec
Max 60sec
0.5mm
0.5mm


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