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TPS2001CDGN датащи(PDF) 2 Page - Texas Instruments |
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TPS2001CDGN датащи(HTML) 2 Page - Texas Instruments |
2 / 26 page TPS20xxC SLVSAU6A –JUNE 2011–REVISED JULY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DEVICE INFORMATION(1) PACKAGED DEVICE(2) MAXIMUM OUTPUT BASE PART OPERATING ENABLE MARKING MSOP-8 (DGN) SOT23-5 DISCHARGE NUMBER CURRENT PowerPAD ™ (DBV) 0.5 Y High TPS2051C – √ VBYQ 1 Y High TPS2065C √ √ VCAQ 1.5 Y High TPS2069C √ – VBUQ 2 Y Low TPS2000C √ – BCMS 2 Y High TPS2001C √ – VBWQ (1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) "-" indicates the device is not available in this package. ABSOLUTE MAXIMUM RATINGS (1) (2) VALUE UNIT MIN MAX Voltage range on IN, OUT, EN or EN, FLT (3) – 0.3 6 V Voltage range from IN to OUT – 6 6 V Maximum junction temperature, TJ Internally Limited HBM 2 kV Electrostatic Discharge CDM 500 V IEC 61000-4-2, Contact / Air (4) 8 15 kV (1) Absolute maximum ratings apply over recommended junction temperature range. (2) Voltages are with respect to GND unless otherwise noted. (3) See the Input and Output Capacitance section. (4) VOUT was surged on a pcb with input and output bypassing per Figure 1 (except input capacitor was 22 µF) with no device failures. THERMAL INFORMATION 0.5 A or 1 A 1.5 A or 2 A 0.5 A or 1 A 1.5 A or 2 A Rated Rated Rated Rated THERMAL METRIC(1) UNITS (See DEVICE INFORMATION table.) DBV DBV DGN DGN 5 PINS 5 PINS 8 PINS 8 PINS θJA Junction-to-ambient thermal resistance 224.9 220.4 72.1 67.1 θJCtop Junction-to-case (top) thermal resistance 95.2 89.7 87.3 80.8 θJB Junction-to-board thermal resistance 51.4 46.9 42.2 37.2 ψJT Junction-to-top characterization parameter 6.6 5.2 7.3 5.6 ° C/W ψJB Junction-to-board characterization parameter 50.3 46.2 42.0 36.9 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A 39.2 32.1 See the Power DIssipation and Junction θJACustom 139.3 134.9 66.5 61.3 Temperature section (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Copyright © 2011, Texas Instruments Incorporated |
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Аналогичное описание - TPS2001CDGN |
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