BZX55C Series

Power Dissipation

Derate above 25°C

Maximum Operating Ambient Temperature

Storage Temperature Range

Soldering Temperature

(5 seconds max.)

Thermal Resistance Junction to Ambient

Thermal Resistance Junction to Mounting Base

500mW

4mW/°C

–55 to +150°C

–65 to +175°C

260°C

336°C/W

140°C/W

MECHANICAL DATA

Dimensions in mm(inches)

21

0.51 ± 0.10

(0.02 ± 0.004)

0.31

(0.012)

1.91 ± 0.10

(0.075 ± 0.004)

3.05 ± 0.13

(0.12 ± 0.005)

1.02 ± 0.10

(0.04 ± 0.004)

1.40

(0.055)

max.

A

0.31

(0.012)

rad.

rad.

A =

3

VOLTAGE REGULATOR

DIODE IN A

CERAMIC SURFACE MOUNT

PACKAGE

FOR HI–REL APPLICATIONS

FEATURES

• HERMETIC CERAMIC SURFACE MOUNT

PACKAGE (SOT23 COMPATIBLE)

• VOLTAGE RANGE 2.4 TO 75V

LCC1 PACKAGE

ABSOLUTE MAXIMUM RATINGS

Pad 1 – Anode

Pad 2 – N/C

Pad 3 – Cathode

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Zener Voltage

Reverse Current

Small Signal Breakdown Impedance

Small Signal Breakdown Impedance

near breakdown knee

V

µA

Ω

Ω

See table 1 for type variants and test parameters.

Underside View

Document Number 5743

Issue 4

Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed

to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.

Semelab encourages customers to verify that datasheets are current before placing orders.