AN823

Vishay Siliconix

www.vishay.com

2

Document Number: 71743

27-Feb-04

255 − 260_C

1X4_C/s (max)

3-6_C/s (max)

10 s (max)

Reflow Zone

Pre-Heating Zone

3_C/s (max)

140 − 170_C

Maximum peak temperature at 240_C is allowed.

FIGURE 3.

Solder Reflow Temperature and Time Durations

60-120 s (min)

217_C

60 s (max)

THERMAL PERFORMANCE

A basic measure of a device’s thermal performance is the

junction-to-case

thermal

resistance,

or

the

measured for the device mounted to an infinite heat sink and

is therefore a characterization of the device only, in other

words, independent of the properties of the object to which the

device is mounted. Table 1 shows the thermal performance

of the TSOP-6.

TABLE 1.

Equivalent Steady State Performance—TSOP-6

30_C/W

SYSTEM AND ELECTRICAL IMPACT OF

TSOP-6

In any design, one must take into account the change in

0.6

0.8

1.0

1.2

1.4

1.6

−50

−25

0

25

50

75

100

125

150

On-Resistance vs. Junction Temperature

FIGURE 4.

Si3434DV