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SM802112 датащи(PDF) 4 Page - Micrel Semiconductor |
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SM802112 датащи(HTML) 4 Page - Micrel Semiconductor |
4 / 12 page Micrel, Inc. SM802112 September 2011 4 M9999-091411-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDO1/2)......................................+4.6V Input Voltage (VIN).............................. −0.50V to VDD + 0.5V Lead Temperature (soldering, 20s)............................ 260°C Case Temperature ..................................................... 115°C Storage Temperature (Ts) ......................... −65°C to +150°C Operating Ratings (2) Supply Voltage (VDD, VDDO1/2)............ +2.375V to +3.465V Ambient Temperature (TA).......................–40°C to +85°C Junction Thermal Resistance (3) QFN ( θJA) Still-Air......................................................24°C/W QFN ( ψJB) Junction-to-Board ......................................8°C/W DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. Symbol Parameter Condition Min. Typ. Max. Units VDD, VDDO1/2 2.5V Operating Voltage 2.375 2.5 2.625 V VDD, VDDO1/2 3.3V Operating Voltage 3.135 3.3 3.465 V IDD Supply current VDD + VDDO Outputs open 125 158 mA LVDS DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 100Ω across Q and /Q. Symbol Parameter Condition Min. Typ. Max. Units VOD Differential Output Voltage Figures 1, 4 275 350 475 mV ΔVOD VOD Magnitude Change 40 mV VOS Offset Voltage 1.15 1.25 1.50 V ΔVOS VOS Magnitude Change 50 mV Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established. |
Аналогичный номер детали - SM802112 |
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Аналогичное описание - SM802112 |
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