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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP-I2C-USB-Z датащи(PDF) 10 Page - Analog Devices |
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ADP-I2C-USB-Z датащи(HTML) 10 Page - Analog Devices |
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10 / 96 page  ADP1046 Data Sheet Rev. 0 | Page 10 of 96 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage (Continuous), VDD 4.2 V Digital Pins: OUTA, OUTB, OUTC, OUTD, OUTAUX, SR1, SR2, GATE, PGOOD1, PGOOD2 −0.3 V to VDD + 0.3 V VS3− to PGND, AGND, DGND −0.3 V to +0.3 V VS1, VS2, VS3+ −0.3 V to VDD + 0.3 V RTD, ADD −0.3 V to VDD + 0.3 V CS1, CS2+, CS2− −0.3 V to VDD + 0.3 V FLAGIN, PSON −0.3 V to VDD + 0.3 V SDA, SCL −0.3 V to VDD + 0.3 V SHAREo, SHAREi −0.3 V to VDD + 0.3 V Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Peak Solder Reflow Temperature SnPb Assemblies (10 sec to 30 sec) 240°C RoHS-Compliant Assemblies (20 sec to 40 sec) 260°C ESD Charged Device Model 1.5 kV ESD Human Body Model 3.5 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA θJC Unit 32-Lead LFCSP 44.4 6.4 °C/W SOLDERING It is important to follow the correct guidelines when laying out the PCB footprint for the ADP1046 and when soldering the part onto the PCB. For detailed information about these guide- lines, see the AN-772 Application Note. ESD CAUTION |
Аналогичный номер детали - ADP-I2C-USB-Z |
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Аналогичное описание - ADP-I2C-USB-Z |
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