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TPS2002C датащи(PDF) 7 Page - Texas Instruments |
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TPS2002C датащи(HTML) 7 Page - Texas Instruments |
7 / 25 page TPS2062C, TPS2066C TPS2060C, TPS2064C TPS2002C, TPS2003C www.ti.com SLVSAX6C – OCTOBER 2011 – REVISED JUNE 2012 DEVICE INFORMATION PIN FUNCTIONS – MSOP-8 PACKAGES NAME TPS2066C/64C TPS2062C/60C I/O DESCRIPTION GND 1 1 Pwr Ground connection IN 2 2 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC EN1 3 - I Enable input channel 1, logic high turns on power switch EN1 - 3 I Enable input channel 1, logic low turns on power switch EN2 4 - I Enable input channel 2, logic high turns on power switch EN2 - 4 I Enable input channel 2, logic low turns on power switch FLT2 5 5 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 2 OUT2 6 6 O Power-switch output channel 2, connected to load OUT1 7 7 O Power-switch output channel 1, connected to load FLT1 8 8 O Active-low open-drain output, asserted during over-current, or overtemperature conditions on channel 1 PowerPAD™ PAD PAD Pwr Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect PAD to GND plane as a heatsink. PIN FUNCTIONS – SOIC-8 PACKAGES NAME TPS2066C TPS2062C I/O DESCRIPTION GND 1 1 Pwr Ground connection IN 2 2 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC EN1 3 - I Enable input channel 1, logic high turns on power switch EN1 - 3 I Enable input channel 1, logic low turns on power switch EN2 4 - I Enable input channel 2, logic high turns on power switch EN2 - 4 I Enable input channel 2, logic low turns on power switch FLT2 5 5 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 2 OUT2 6 6 O Power-switch output channel 2, connected to load OUT1 7 7 O Power-switch output channel 1, connected to load FLT1 8 8 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 1 PIN FUNCTIONS – SON-10 PACKAGES NAME TPS2003C TPS2002C I/O DESCRIPTION GND 1 1 Pwr Ground connection IN 2, 3 2, 3 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC EN1 4 – I Enable input channel 1, logic high turns on power switch EN1 – 4 I Enable input channel 1, logic low turns on power switch EN2 5 – I Enable input channel 2, logic high turns on power switch EN2 – 5 I Enable input channel 2, logic low turns on power switch FLT2 6 6 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 2 NC 7 7 No connect – leave floating. OUT2 8 8 O Power-switch output channel 2, connect to load OUT1 9 9 O Power-switch output channel 1, connect to load FLT1 10 10 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on channel 1 PowerPAD™ PAD PAD Pwr Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect PAD to GND plane as a heatsink. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TPS2062C TPS2066C TPS2060C TPS2064C TPS2002C TPS2003C |
Аналогичный номер детали - TPS2002C |
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Аналогичное описание - TPS2002C |
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