DAC5311

DAC6311

DAC7311

SBAS442A

– AUGUST 2008 – REVISED AUGUST 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

MAXIMUM

MAXIMUM

RELATIVE

DIFFERENTIAL

SPECIFIED

ACCURACY

NONLINEARITY

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

PRODUCT

(LSB)

(LSB)

LEAD

DESIGNATOR

RANGE

MARKING

DAC5311

±0.25

±0.25

SC70-6

DCK

–40°C to 125°C

D53

DAC6311

±0.5

±0.5

SC70-6

DCK

–40°C to 125°C

D63

DAC7311

±1

±1

SC70-6

DCK

–40°C to 125°C

D73

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the

ABSOLUTE MAXIMUM RATINGS

(1)

PARAMETER

VALUE

UNIT

–0.3 to +6

V

Digital input voltage to GND

V

V

Operating temperature range

–40 to +125

°C

Storage temperature range

–65 to +150

°C

+150

°C

Power dissipation

W

250

°C/W

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

2

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© 2008–2011, Texas Instruments Incorporated