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LM4040C25MDBZTEP датащи(PDF) 2 Page - Texas Instruments |
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LM4040C25MDBZTEP датащи(HTML) 2 Page - Texas Instruments |
2 / 12 page CATHODE ANODE _ + LM4040-EP SLOS746A – SEPTEMBER 2011 – REVISED SEPTEMBER 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM Absolute Maximum Ratings (1) over free-air temperature range (unless otherwise noted) MIN MAX UNIT IZ Continuous cathode current –10 25 mA TJ Operating virtual junction temperature 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION LM4040 THERMAL METRIC(1) DBZ UNITS 3 PINS θJA Junction-to-ambient thermal resistance(2) 320.8 θJC Junction-to-case thermal resistance 98.2 θJB Junction-to-board thermal resistance(3) 53.3 °C/W ψJT Junction-to-top characterization parameter(4) 3.3 ψJB Junction-to-board characterization parameter(5) 51.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated |
Аналогичный номер детали - LM4040C25MDBZTEP |
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Аналогичное описание - LM4040C25MDBZTEP |
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