TPS2530

SLUSB67 – AUGUST 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

–0.3

6

V

Voltage range from IN to OUT

–6

6

V

Internally Limited

HBM

2

kV

Electrostatic Discharge

CDM

500

V

8

15

kV

(1)

Voltages are with respect to GND unless otherwise noted.

(2)

See the Input and Output Capacitance section.

(3)

THERMAL INFORMATION

TPS2530

UNITS

DBV (5 PINS)

Junction-to-ambient thermal resistance

224.9

Junction-to-case (top) thermal resistance

95.2

Junction-to-board thermal resistance

51.4

°C/W

Junction-to-top characterization parameter

6.6

Junction-to-board characterization parameter

50.3

Junction-to-case (bottom) thermal resistance

N/A

spacer

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage, IN

2.7

5.5

V

Input voltage, EN

0

5.5

V

High-level input voltage, EN

2

V

Low-level input voltage, EN

0.7

V

Continuous output current, OUT (TPS2530)

0.5

A

Operating junction temperature

–40

125

°C

Sink current into FLT

0

5

mA

2

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