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SN74HC10QDREP датащи(PDF) 1 Page - Texas Instruments

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номер детали SN74HC10QDREP
подробное описание детали  TRIPLE 3-INPUT POSITIVE-NAND GATE
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

SN74HC10QDREP датащи(HTML) 1 Page - Texas Instruments

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SN74HC10EP
TRIPLE 3INPUT POSITIVENAND GATE
SCLS558 − JANUARY 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D Extended Temperature Performance of
−40
°C to 125°C
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree
D Wide Operating Voltage Range of 2 V to 6 V
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D Outputs Can Drive Up To 10 LSTTL Loads
D Low Power Consumption, 20-µA Max ICC
D Typical tpd = 9 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
description/ordering information
The SN74HC10 device contains three independent 3-input NAND gates. It performs the Boolean function
Y = A
• B • C or Y = A + B + C in positive logic.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40
°C to 125°C
SOIC − D
Tape and reel
SN74HC10QDREP
SHC10EP
−40
°C to 125°C
TSSOP − PW
Tape and reel
SN74HC10QPWREP
SHC10EP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A
B
C
OUTPUT
Y
H
H
H
L
L
XX
H
X
LX
H
X
X
L
H
logic diagram (positive logic)
A
C
Y
B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
2A
2B
2C
2Y
GND
VCC
1C
1Y
3C
3B
3A
3Y
D OR PW PACKAGE
(TOP VIEW)
Copyright
 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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